Nano·Micro Structure Chip Design & Manufacture(OEM/ODM)
Design & Modeling
Optimized design and analysis of fluid flowing models and structures of chambers, channels, inlets, outlets, etc.
A Micro-Channel Design of a High Throughput Micro-fluidic Device for Screening Circulating Tumor Cells from the Blood Sample
Numerical flow analysis for optimization of the micro-fluidic channel design to enhance the throughput of the fluid sample and the uniformity of the flow
Numerical flow analysis and design optimization for the manifold of the multi-layer micro-fluidic device to deliver fluid sample uniformly to the micro-channels
Nano·Micro Patterned Stamper
Manufacturing nano/micro patterned molds utilizing MEMS technologies.
Micro/nano patterns are transferred onto Si-wafer or Quartz by using semiconductor processes such as photolithography, scanner, laser direct writing, and Ni plating is performed according to the applications to provide Ni base molds.
Pattern size: 100nm ~ hundreds of μm, aspect ratio < 3
Pattern shape: Pillar, Grating, Pinhole, Channel, etc.
Materials: Si-wafer, Quartz, Sodalime glass, Metal, etc
microfluidic platforms for point-of-care testing, anti-reflective structures ect
Nano·Micro Injection Molding
Microfluidic channels or MEMS based nano/micro platforms in polymers can be injection molded.
Mass production of sophisticated plastic products such as microfluidic channels with higher productivity and yield by applying highly-precise molds equiped with rapid heating & cooling system.
Pattern size: 100nm ~ hundreds of μm, aspect ratio < 5
Pattern shape: Pillar, Channel, etc.
Processing area: 30mm×30mm ~ 400mm×400mm
Materials: PMMA, PC, PP, COC, TPU, etc.
Heating & cooling systems on molds
Microfluidic channels for various in-vitro diagnostic and point-of-care testing devices
liposome synthesis device
Packaging technology for plastic-plastic, film-plastic, plastic-wafer, and film-wafer is the finishing process of injection molded parts. It shows excellent sealing and bonding properties, which has been technologically invested by Korea Institute of Machinery & Materials as follows.
Packaging by Ultrasonic Welding & Mechanical Contact
Good success rate(> 95%)
Good productivity (cycle time ~ 15 sec)
Packaging by Film Thermal Lamination
Typical packaging for microfluidic platforms currently
Good for a handy device
A Reversible Packaging Solution
Uniform contact pressure at the interface
Controllable sealing level during operation
Excellent success rate(~ 100%) and productivity (< a few seconds)
Very short lead time for packaging
Packaging for microfluidic channel based devices, and MEMS or Bio-MEMS based devices