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Assembly-Packaging
Packaging technology for plastic-plastic, film-plastic, plastic-wafer, and film-wafer is the finishing process of injection molded parts. It shows excellent sealing and bonding properties, which has been technologically invested by Korea Institute of Machinery & Materials as follows.
Packaging by Ultrasonic Welding & Mechanical Contact
Hermetic sealing
Good adhesion
Good success rate(> 95%)
Good productivity (cycle time ~ 15 sec)
Packaging by Film Thermal Lamination
Typical packaging for microfluidic platforms currently
Good for a handy device
A Reversible Packaging Solution
Uniform contact pressure at the interface
Hermetic sealing
Controllable sealing level during operation
Excellent success rate(~ 100%) and productivity (< a few seconds)
Very short lead time for packaging
Application
Packaging for microfluidic channel based devices, and MEMS or Bio-MEMS based devices