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Assembly-Packaging

Packaging technology for plastic-plastic, film-plastic, plastic-wafer, and film-wafer is the finishing process of injection molded parts. It shows excellent sealing and bonding properties, which has been technologically invested by Korea Institute of Machinery & Materials as follows.


Packaging by Ultrasonic Welding & Mechanical Contact

Hermetic sealing

Good adhesion

Good success rate(> 95%)

Good productivity (cycle time ~ 15 sec)

Packaging by Film Thermal Lamination

Typical packaging for microfluidic platforms currently

Good for a handy device

A Reversible Packaging Solution

Uniform contact pressure at the interface

Hermetic sealing

Controllable sealing level during operation

Excellent success rate(~ 100%) and productivity (< a few seconds)

Very short lead time for packaging



Application

Packaging for microfluidic channel based devices, and MEMS or Bio-MEMS based devices